Intel To Launch New Core Processor Branding for Meteor Lake: Drop the i, Add Ultra Tier

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Cadence Buys Memory and SerDes PHY Assets from Rambus

AMD Launches Ryzen 5 7500F in China: Zen 4 With no Integrated Graphics

TSMC: 3nm Chips for Smartphones and HPCs Coming This Year

Ultra Ethernet Consortium Formed, Plans to Adapt Ethernet for AI and HPC Needs

Cerebras to Enable 'Condor Galaxy' Network of AI Supercomputers: 36 ExaFLOPS for AI

Solidigm Announces D5-P5336: 64 TB-Class Data Center SSD Sets NVMe Capacity Records

TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers

ASUS Signs Agreement to Continue Development and Support of Intel's NUC Business

Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin

Logitech Acquires Loupedeck to Enhance Its Software Roadmap

Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report

Lenovo Develops Mini-ITX Form-Factor GeForce RTX 4060

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PIPELINE STORIES. + Submit News. Cadence Buys Memory and SerDes PHY Assets from Rambus. AMD Launches Ryzen 5 7500F in China: Zen 4 With no Integrated Graphics. TSMC: 3nm Chips for Smartphones and HPCs Coming This Year. Ultra Ethernet Consortium Formed, Plans to Adapt Ethernet for AI and HPC Needs. Cerebras to Enable 'Condor Galaxy' Network of AI Supercomputers: 36 ExaFLOPS for AI. Solidigm Announces D5-P5336: 64 TB-Class Data Center SSD Sets NVMe Capacity Records. TSMC Delays Arizona Fab Deployment to 2025, Citing Shortage of Skilled Workers. ASUS Signs Agreement to Continue Development and Support of Intel's NUC Business. Samsung Completes Initial GDDR7 Development: First Parts to Reach Up to 32Gbps/pin. Logitech Acquires Loupedeck to Enhance Its Software Roadmap. Samsung Shipping First GAAFET Silicon; 3nm and 4nm Yields Are Improving - Report. Lenovo Develops Mini-ITX Form-Factor GeForce RTX 4060.